Job Description

Job Advert

Senior WBG Chip Engineer

Location:

Lincoln (Office-based)

Department:

Research & Development

Reporting to:

Chip Team Lead

About the Role

Dynex is expanding its Research & Development capability and is seeking a

Senior Wide Band Gap (WBG) Chip Engineer

to join its semiconductor chip development team. This role focuses on the design, simulation and characterisation of next-generation

GaN- and Ga

?

O

?

-based power semiconductor devices

, contributing directly to future WBG product platforms.


You will work closely with experienced device, process and layout engineers, applying TCAD simulation and experimental analysis to support innovative device concepts from design through to characterisation. This is an excellent opportunity for an ambitious engineer looking to deepen their expertise in WBG technologies and progress within a growing R&D organisation.

Key Responsibilities

Design and develop WBG power semiconductor devices, including GaN- and Ga?O?-based structures Perform 2D and 3D TCAD simulations to evaluate device performance Analyse simulation and experimental data to correlate design parameters with electrical behaviour Support device testing and characterisation, including static I-V and breakdown measurements Collaborate with layout engineers on chip layout reviews and mask preparation Produce clear technical reports and presentations documenting results and conclusions Identify novel design features and support intellectual property generation Contribute to process development through understanding design-process interactions Work in accordance with R&D procedures and support continuous improvement initiatives

Collaboration & Communication

Work effectively within multidisciplinary project teams across R&D and other departments Communicate complex technical concepts clearly to both technical and non-technical stakeholders Build productive working relationships with colleagues, partners, suppliers and academic collaborators Take ownership of assigned engineering tasks and deliver against agreed objectives

Skills, Knowledge & Experience

Essential:

Experience using 2D/3D TCAD tools (e.g. Silvaco, Synopsys) for device simulation Solid understanding of semiconductor device physics (e.g. IGBTs, MOSFETs, Schottky diodes, FinFETs) Experience with power semiconductor fabrication processes Hands-on device characterisation using semiconductor parameter analysers Ability to analyse and interpret electrical data Proficiency with standard Microsoft software packages

Desirable:

Experience with WBG technologies (SiC, GaN or Ga?O?) Knowledge of high-voltage or reliability behaviour (breakdown, leakage, thermal effects) Familiarity with chip layout tools Understanding of power electronics applications such as inverters or power modules Experience working in a fabless or foundry-based development environment

Qualifications

MSc in a relevant science or engineering discipline with 3+ years' relevant industry experience,

or

PhD (or equivalent) in a relevant science or engineering discipline

Why Join Dynex?

Dynex offers a technically stimulating environment with strong opportunities for

career development, responsibility growth and promotion

. You will be part of a forward-looking R&D team working on cutting-edge WBG technologies with real-world impact.


Dynex is committed to equality of opportunity and maintaining the highest standards of health, safety and environmental responsibility.



The role is based at our site in Lincoln.

Please note: if you are shortlisted, you will receive an email inviting you to attend an interview. Please be aware that the invitation may appear in your spam or junk folder.