Job Description

Description

Job Responsibilities

1.

Technical Pre - research and Innovation

- Lead the development of

forward - looking technologies (such as new bonding materials, surface micro - nano processing, 3D integration, etc.) and explore feasible paths for process implementation.

- Design experiments to verify the compatibility of new process modules with existing manufacturing processes.

2.

Process Integration Prototype Development

- Establish a new process integration framework and formulate cross - module collaboration plans.

- Verify key parameters through Design of Experiments (DOE) and output Technical Design Rules.

- Be proficient in conducting in - depth analysis from the execution results of the plan to the process mechanism.

3.

Cross - team Collaboration and Transformation

- Collaborate with TD (Technical R&D), production processes, etc., to transform laboratory - level technologies into manufacturable solutions.

- Participate in formulating the technical roadmap, and assess the requirements for equipment and materials as well as technical risks of new processes.

4.

Intellectual Property and Academic Output

- Write technical patents and participate in the formulation of industry technical standards.

- Track top - tier international conference papers (such as IEDM, VLSI), and extract implementable technical directions.

Competency Requirements

1.

Hard Skills

-

Technical Vision: Have an in - depth understanding of cutting - edge semiconductor technologies (such as heterogeneous integration).

- Candidates with simulation and modeling capabilities will be preferred.

-

Experimental Design Ability: Be proficient in designing DOE experiments with wide coverage and high complexity to quickly converge on technical paths.

2.

Soft Skills

- Innovative Thinking: Break through the existing technical framework and propose disruptive process integration solutions.

- Academic Acumen: Extract key technical points from papers and patents and convert them into experimental directions.

- Interdisciplinary Collaboration: Jointly develop customized solutions with materials scientists and equipment manufacturer

Other Requirements

1. Educational Background

- Degree: A doctoral degree is preferred, majoring in microelectronics, physics, materials science and engineering, chemistry, mechanical engineering, etc.

-

Research Directions: Nanodevice physics, advanced process integration, new semiconductor materials, etc.

2.

Experience Requirements

- Project Experience: Have participated in national - level or enterprise - level advanced technology R&D projects.

- Technical Achievements: Have published highly - influential papers or led the writing of key patents.

More details on : www.icautochina.com

Job Types: Full-time, Permanent, Temp to perm
Contract length: 36 months

Pay: 100,000.00-120,000.00 per year

Work Location: In person

Reference ID: ProcessIntegrationContractJobs