We are seeking an experienced and innovative Team Lead for Films Technology to drive the development, optimisation, and integration of thin-film processes for advanced MicroLED display devices. This role oversees end-to-end technology development, including epitaxial layers, passivation films, optical coatings, buffer layers, and functional thin films critical to MicroLED performance, yield, and reliability. The ideal candidate has strong technical depth in semiconductor materials and thin-film engineering, along with proven leadership experience in guiding cross-functional teams.
Key Responsibilities
Drive process innovation to enhance device efficiency, reliability, uniformity, and surface quality
Take ownership of deposition process modules (PVD, ALD, PECVD, sputtering, evaporation, plating) and ensure stable, high-quality film performance
Work closely with epitaxy, device, and integration teams to define film requirements and deliver optimised stack architectures
Establish and refine process windows through DOE, SPC, and data-led analysis
Identify and resolve thin-film defect mechanisms such as particles, stress, adhesion, moisture ingress, and interface issues
Support reliability engineering by assessing film stability under thermal, optical, electrical, and environmental stress
Utilise advanced metrology (SEM, TEM, AFM, ellipsometry, XRR, XPS, SIMS, etc.) to ensure film quality and process control
Act as Tool Owner for assigned equipment, maintaining tool performance, uptime, safety, and accurate documentation
Lead continuous improvement initiatives to reduce downtime, enhance tool capability, and troubleshoot complex tool or process issues
Provide day-to-day leadership to the module team, including line management of Apprentices, Graduates, Engineers, and Senior Engineers
Conduct performance reviews, set objectives, and support the technical and professional development of team members
Oversee resource planning to ensure effective deployment of personnel, equipment, and expertise across projects
Collaborate with the Module Manager to align team activities with broader project and company objectives
Experience & Attributes
Master's or PhD in Materials Science, Electrical Engineering, Applied Physics, or a related discipline
Significant industry experience (7+ years) in thin-film engineering within the semiconductor industry
Practical expertise in thin-film deposition (PVD, ALD, PECVD, MOCVD, sputtering, evaporation)
Strong background in microfabrication and device process integration
Proven experience leading engineers, projects, or technical teams
Demonstrated tool ownership
Strong technical judgement and decision-making skills
Effective cross-functional communication and collaboration
Excellent problem-solving skills, particularly in ambiguous or fast-moving environments
Ability to prioritise and deliver within tight development cycles
Strategic thinker with the ability to plan roadmaps and guide technology direction
Advantage
Experience with GaN-based device processing and characterisation
Good understanding of MicroLED device architecture, materials challenges, and reliability mechanisms
Previous line management experience
Knowledge of optical coatings and light-management films used in display devices
Familiarity with high-volume manufacturing (HVM) processes and scaling challenges
Experience in defect engineering, surface passivation, or interfacial film optimisation
Plessey is working with world leaders in consumer technology, who are paving the way with innovative next-generation Augmented Reality and wearable applications, based on advanced microLED display solutions.
Challenging existing display technologies, microLEDs are propelling forward a vast, yet stagnated market, changing the way we interact with our devices, both for information and entertainment.
Drawing on over a decade of semiconductor and optoelectronics expertise, Plessey has developed an award-winning, unique, and proprietary GaN-on-Silicon platform and monolithic process at its state-of-the-art manufacturing facility.
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